Request a Quote on 128EDCC00766-1 Northrop Grumman Systems Corporation Part with the NSN 5962013219018

Part Number: 128EDCC00766-1

Alternate P/N: 128EDCC007661

Manufacturer: Northrop Grumman Systems Corporation

NSN: 5962-01-321-9018

NIIN: 013219018

Item Name : Microcircuit Memory

CAGE Code: 79RG9

FSC: 5962 Microcircuits Electronic

FSG: 59 Electrical and Electronic Equipment Components

Country: USA

NCB Code: 01

Thank you for taking an interest in part number 128EDCC00766-1, a Northrop Grumman Systems Corporation product we have in stock that is listed alongside the NSN 5962013219018 and the description “Microcircuit Memory.” As part number 128EDCC00766-1 is readily available for purchase on our website at any time, you are invited to fill out and submit the RFQ form provided on this page for the means of requesting a quote for your comparisons. All that we ask is that you supply us with important information such as your target price and expected shipping time frame so that we can best tailor a solution that caters to your unique needs and restrictions alike.

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To ensure that you only procure the exact items you require for carrying out operations, we list all aerospace parts, military and defense parts, and other product offerings with all applicable information for identification. For example, part number 128EDCC00766-1 is listed alongside the NSN 5962-01-321-9018, meaning that it also belongs to FSC 5962 Microcircuits Electronic. Furthermore, this NSN part is specifically manufactured under CAGE Code 79RG9, a unique identifier belonging to the manufacturer for a specific facility. With all of this in mind, kick off purchasing with us today and see why so many customers steadily choose us for their operational needs.

NSN Information for Part Number 128EDCC00766-1 with NSN 5962-01-321-9018, 5962013219018

NSN	FSC	NIIN	CLS	Hazmat	DEMIL	Cancelled NSN
5962-01-321-9018 Item PartTypeName: MICROCIRCUIT,MEMORY	5962	013219018	0	N	B
	CIIC	HCC	ESD	PMIC	Criticality	ENAC
	U		B	A	0
Part Number	ISC	RNVC	RNCC	HCC	MSDS	SADC
ROM/PROM	2	1	5

Characteristics Data of NSN 5962-01-321-9018, 5962013219018

MRC	Criteria	Characteristic
ABHP	OVERALL LENGTH	1.490 INCHES MAXIMUM
ABKW	OVERALL HEIGHT	0.432 INCHES MAXIMUM
ABMK	OVERALL WIDTH	0.620 INCHES MAXIMUM
ADAQ	BODY LENGTH	1.490 INCHES MAXIMUM
ADAT	BODY WIDTH	0.610 INCHES MAXIMUM
ADAU	BODY HEIGHT	0.217 INCHES MAXIMUM
AEHX	MAXIMUM POWER DISSIPATION RATING	1.0 WATTS
AFGA	OPERATING TEMP RANGE	-55.0 TO 125.0 DEG CELSIUS
AFJQ	STORAGE TEMP RANGE	-65.0 TO 150.0 DEG CELSIUS
CBBL	FEATURES PROVIDED	BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED AND ULTRAVIOLET ERASABLE
CQSJ	INCLOSURE MATERIAL	CERAMIC
CQSZ	INCLOSURE CONFIGURATION	DUAL-IN-LINE
CQWX	OUTPUT LOGIC FORM	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
CQZP	INPUT CIRCUIT PATTERN	16 INPUT
CTFT	CASE OUTLINE SOURCE AND DESIGNATOR	D-10 MIL-M-38510
CWSG	TERMINAL SURFACE TREATMENT	SOLDER
CZEN	VOLTAGE RATING AND TYPE PER CHARACTERISTIC	7.0 VOLTS MAXIMUM POWER SOURCE
CZEQ	TIME RATING PER CHACTERISTIC	200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT
CZER	MEMORY DEVICE TYPE	ROM
TEST	TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.).
TTQY	TERMINAL TYPE AND QUANTITY	28 PRINTED CIRCUIT