Request a Quote on L7C199HMB35 Logic Devices Incorporated Part with the NSN 5962014120260

Part Number: L7C199HMB35

Manufacturer: Logic Devices Incorporated

NSN: 5962-01-412-0260

NIIN: 014120260

Item Name : Microcircuit Memory

CAGE Code: 65896

FSC: 5962 Microcircuits Electronic

FSG: 59 Electrical and Electronic Equipment Components

Country: USA

NCB Code: 01

Thank you for taking an interest in part number L7C199HMB35, a Logic Devices Incorporated product we have in stock that is listed alongside the NSN 5962014120260 and the description “Microcircuit Memory.” As part number L7C199HMB35 is readily available for purchase on our website at any time, you are invited to fill out and submit the RFQ form provided on this page for the means of requesting a quote for your comparisons. All that we ask is that you supply us with important information such as your target price and expected shipping time frame so that we can best tailor a solution that caters to your unique needs and restrictions alike.

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To ensure that you only procure the exact items you require for carrying out operations, we list all aerospace parts, military and defense parts, and other product offerings with all applicable information for identification. For example, part number L7C199HMB35 is listed alongside the NSN 5962-01-412-0260, meaning that it also belongs to FSC 5962 Microcircuits Electronic. Furthermore, this NSN part is specifically manufactured under CAGE Code 65896, a unique identifier belonging to the manufacturer for a specific facility. With all of this in mind, kick off purchasing with us today and see why so many customers steadily choose us for their operational needs.

NSN Information for Part Number L7C199HMB35 with NSN 5962-01-412-0260, 5962014120260

NSN	FSC	NIIN	CLS	Hazmat	DEMIL	Cancelled NSN
5962-01-412-0260 Item PartTypeName: MICROCIRCUIT,MEMORY	5962	014120260	0	N	D
	CIIC	HCC	ESD	PMIC	Criticality	ENAC
	7		D	A	0
Part Number	ISC	RNVC	RNCC	HCC	MSDS	SADC
5962-8866205XB	5	9	5

Characteristics Data of NSN 5962-01-412-0260, 5962014120260

MRC	Criteria	Characteristic
ADAQ	BODY LENGTH	1.490 INCHES MAXIMUM"
ADAT	BODY WIDTH	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM"
ADAU	BODY HEIGHT	0.214 INCHES MINIMUM AND 0.224 INCHES MAXIMUM"
AEHX	MAXIMUM POWER DISSIPATION RATING	1.00 WATTS"
AFGA	OPERATING TEMP RANGE	-55.0 TO 125.0 DEG CELSIUS"
AFJQ	STORAGE TEMP RANGE	-65.0 TO 150.0 DEG CELSIUS"
CQSJ	INCLOSURE MATERIAL	CERAMIC"
CQSZ	INCLOSURE CONFIGURATION	DUAL-IN-LINE"
CQWX	OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC"
CTQX	CURRENT RATING PER CHARACTERISTIC	150.00 MILLIAMPERES MAXIMUM SUPPLY"
CWSG	TERMINAL SURFACE TREATMENT	SOLDER"
CZEN	VOLTAGE RATING AND TYPE PER CHARACTERISTIC	0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE"
CZEP	CAPITANCE RATING PER CHARACTERISTIC	150.00 INPUT PICOFARADS MAXIMUM"
CZEQ	TIME RATING PER CHACTERISTIC	35.00 NANOSECONDS MAXIMUM ACCESS"
CZER	MEMORY DEVICE TYPE	RAM"
CZES	HYBRID TECHNOLOGY TYPE	MONOLITHIC"
TTQY	TERMINAL TYPE AND QUANTITY	28 PRINTED CIRCUIT"
ADAQ	BODY LENGTH	1.490 INCHES MAXIMUM"
ADAT	BODY WIDTH	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM"
ADAU	BODY HEIGHT	0.214 INCHES MINIMUM AND 0.224 INCHES MAXIMUM"
AEHX	MAXIMUM POWER DISSIPATION RATING	1.00 WATTS"
AFGA	OPERATING TEMP RANGE	-55.0 TO 125.0 DEG CELSIUS"
AFJQ	STORAGE TEMP RANGE	-65.0 TO 150.0 DEG CELSIUS"
CQSJ	INCLOSURE MATERIAL	CERAMIC"
CQSZ	INCLOSURE CONFIGURATION	DUAL-IN-LINE"
CQWX	OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC"
CTQX	CURRENT RATING PER CHARACTERISTIC	150.00 MILLIAMPERES MAXIMUM SUPPLY"
CWSG	TERMINAL SURFACE TREATMENT	SOLDER"
CZEN	VOLTAGE RATING AND TYPE PER CHARACTERISTIC	0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE"
CZEP	CAPITANCE RATING PER CHARACTERISTIC	150.00 INPUT PICOFARADS MAXIMUM"
CZEQ	TIME RATING PER CHACTERISTIC	35.00 NANOSECONDS MAXIMUM ACCESS"
CZER	MEMORY DEVICE TYPE	RAM"
CZES	HYBRID TECHNOLOGY TYPE	MONOLITHIC"
TTQY	TERMINAL TYPE AND QUANTITY	28 PRINTED CIRCUIT"