Thank you for taking an interest in part number MCM6604AL2, a Freescale Semiconductor Inc product we have in stock that is listed alongside the NSN 5962011462105 and the description “Microcircuit Memory.” As part number MCM6604AL2 is readily available for purchase on our website at any time, you are invited to fill out and submit the RFQ form provided on this page for the means of requesting a quote for your comparisons. All that we ask is that you supply us with important information such as your target price and expected shipping time frame so that we can best tailor a solution that caters to your unique needs and restrictions alike.
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To ensure that you only procure the exact items you require for carrying out operations, we list all aerospace parts, military and defense parts, and other product offerings with all applicable information for identification. For example, part number MCM6604AL2 is listed alongside the NSN 5962-01-146-2105, meaning that it also belongs to FSC 5962 Microcircuits Electronic. Furthermore, this NSN part is specifically manufactured under CAGE Code 04713, a unique identifier belonging to the manufacturer for a specific facility. With all of this in mind, kick off purchasing with us today and see why so many customers steadily choose us for their operational needs.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-146-2105 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 011462105 | N | B | ||
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
B | A | 0 | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
TMS4027 | 1 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.800 INCHES NOMINAL |
ADAT | BODY WIDTH | 0.288 INCHES NOMINAL |
ADAU | BODY HEIGHT | 0.095 INCHES NOMINAL |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.25 WATTS |
AFGA | OPERATING TEMP RANGE | 0.0/70.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
AGAV | END ITEM IDENTIFICATION | 4920-01-049-0223 E/I FSCM 88818 |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND 3-STATE OUTPUT AND EXPANDABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 20.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 375.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 375.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | RAM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TEST | TEST DATA DOCUMENT | 28480-1818-0334 DRAWING (THIS IS THE BASIC GOVERNING DRAWING,SUCH AS A CONTRACTOR DRAWING,ORIGINAL EQUIPMENT MANUFACTURER DRAWING,ETC.; EXCLUDES ANY SPECIFICATION,STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DR |
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
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