Thank you for taking an interest in part number 1601DMQB70, a Fairchild Semiconductor Corp product we have in stock that is listed alongside the NSN 5962012453441 and the description “Microcircuit Memory.” As part number 1601DMQB70 is readily available for purchase on our website at any time, you are invited to fill out and submit the RFQ form provided on this page for the means of requesting a quote for your comparisons. All that we ask is that you supply us with important information such as your target price and expected shipping time frame so that we can best tailor a solution that caters to your unique needs and restrictions alike.
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To ensure that you only procure the exact items you require for carrying out operations, we list all aerospace parts, military and defense parts, and other product offerings with all applicable information for identification. For example, part number 1601DMQB70 is listed alongside the NSN 5962-01-245-3441, meaning that it also belongs to FSC 5962 Microcircuits Electronic. Furthermore, this NSN part is specifically manufactured under CAGE Code 07263, a unique identifier belonging to the manufacturer for a specific facility. With all of this in mind, kick off purchasing with us today and see why so many customers steadily choose us for their operational needs.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-245-3441 Item Description: Microcircuit Memory | 5962 | 012453441 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
1601dmqb70 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
CZEQ | Time Rating Per Chacteristic | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | Memory Device Type | RAM |
AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
CQZP | Input Circuit Pattern | 19 INPUT |
CBBL | Features Provided | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND HIGH RELIABILITY AND W/ENABLE |
CQSJ | Inclosure Material | CERAMIC |
ADAT | Body Width | 0.310 INCHES MAXIMUM |
TTQY | Terminal Type And Quantity | 22 PRINTED CIRCUIT |
CWSG | Terminal Surface Treatment | SOLDER |
ADAQ | Body Length | 1.111 INCHES MAXIMUM |
AEHX | Maximum Power Dissipation Rating | 1.0 WATTS |
ADAU | Body Height | 0.180 INCHES MAXIMUM |
TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
MRC | Decoded Requirement | Clear Text Reply |
CQSZ | Inclosure Configuration | DUAL-IN-LINE |
AFGA | Operating Temp Range | -55.0/+125.0 DEG CELSIUS |
CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CZEN | Voltage Rating And Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZZZ | Memory Capacity | UNKNOWN |
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