Thank you for taking an interest in part number DH75694, a Advanced Micro Devices Inc product we have in stock that is listed alongside the NSN 5962011230798 and the description “Microcircuit Memory.” As part number DH75694 is readily available for purchase on our website at any time, you are invited to fill out and submit the RFQ form provided on this page for the means of requesting a quote for your comparisons. All that we ask is that you supply us with important information such as your target price and expected shipping time frame so that we can best tailor a solution that caters to your unique needs and restrictions alike.
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To ensure that you only procure the exact items you require for carrying out operations, we list all aerospace parts, military and defense parts, and other product offerings with all applicable information for identification. For example, part number DH75694 is listed alongside the NSN 5962-01-123-0798, meaning that it also belongs to FSC 5962 Microcircuits Electronic. Furthermore, this NSN part is specifically manufactured under CAGE Code 34335, a unique identifier belonging to the manufacturer for a specific facility. With all of this in mind, kick off purchasing with us today and see why so many customers steadily choose us for their operational needs.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-123-0798 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 011230798 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 932681-1B | 5 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.440 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.285 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | RADAR 76301 |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND 3-STATE OUTPUT AND BIPOLAR |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | F-5 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 82577-932681 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 FLAT LEADS |
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