Item Name | Microcircuit Memory |
Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
National Item Identification Number (NIIN) | 01-078-1814 (010781814) |
NCB Code | USA (01) |
Manufacturer | Texas Instruments Inc, Northrop Grumman Systems Corporation, Intersil Corporation, Dla Land And Maritime, Philips Semiconductors Ltd, Raytheon Company, Leonardo Mw Ltd, Advanced Micro Devices Inc, National Semiconductor Corporation, Thales Defense And Security Inc |
Part Number | Manufacturer | Item Name | Cage Code | RFQ |
---|---|---|---|---|
SN74S288J | texas instruments inc | microcircuit memory | 01295 | RFQ |
058-002131-001 | northrop grumman systems corporation | microcircuit memory | 26916 | RFQ |
058-002131-001 | intersil corporation | microcircuit memory | 34371 | RFQ |
058-002018 | northrop grumman systems corporation | microcircuit memory | 26916 | RFQ |
ROM/PROM FAMILY 013 | dla land and maritime | microcircuit memory | 16236 | RFQ |
058-002131-001 | texas instruments inc | microcircuit memory | 01295 | RFQ |
058-002131-001 | philips semiconductors ltd | microcircuit memory | 18324 | RFQ |
803835-1 | raytheon company | microcircuit memory | 96214 | RFQ |
28721-41001 | leonardo mw ltd | microcircuit memory | k0662 | RFQ |
AM27S09DC | advanced micro devices inc | microcircuit memory | 34335 | RFQ |
058-002131-001 | national semiconductor corporation | microcircuit memory | 27014 | RFQ |
DM54S288J 883 | national semiconductor corporation | microcircuit memory | 27014 | RFQ |
HM1-7603-8 | intersil corporation | microcircuit memory | 34371 | RFQ |
S82S123F 883B | philips semiconductors ltd | microcircuit memory | 18324 | RFQ |
115370-0003 | thales defense and security inc | microcircuit memory | 65597 | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.750 INCHES MINIMUM AND 0.795 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.120 INCHES MINIMUM AND 0.195 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 512.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND SCHOTTKY AND 3-STATE OUTPUT AND W/DECODED OUTPUT AND PROGRAMMABLE AND PROGRAMMED AND W/ENABLE AND W/DISABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 6 INPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | -0-001-AG JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TEST | TEST DATA DOCUMENT | 26916-058-002131 DRAWING (THIS IS THE BASIC GOVERNING DRAWING,SUCH AS A CONTRACTOR DRAWING,ORIGINAL EQUIPMENT MANUFACTURER DRAWING,ETC.; EXCLUDES ANY SPECIFICATION,STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING D |
TTQY | TERMINAL TYPE AND QUANTITY | 16 FLAT LEADS |
Relevant Components for NSN - 5962-01-078-1814, 5962010781814 | ||||
5930-01-201-0344 (5930012010344) | 5935-00-733-6624 (5935007336624) | 5935-01-670-0032 (5935016700032) | 5935-01-238-8280 (5935012388280) | |
5945-00-772-0597 (5945007720597) | 5998-01-470-7299 (5998014707299) | 5998-01-450-1035 (5998014501035) | 5995-01-305-0350 (5995013050350) | |
5935-01-438-9012 (5935014389012) | 5998-01-080-8351 (5998010808351) | 5998-01-518-1172 (5998015181172) | 5935-01-141-2602 (5935011412602) | |
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